What’s CMOS 2.0? – IEEE Spectrum

CMOS, the silicon logic know-how behind many years and many years of smaller transistors and quicker computer systems, is getting into a brand new section. CMOS makes use of two forms of transistors in pairs to restrict a circuit’s energy consumption. On this new section, “CMOS 2.0,” that half’s not going to alter, however how processors and different advanced CMOS chips are made will. Julien Ryckaert, vice chairman of logic applied sciences at Imec, the Belgium-based nanotechnology analysis middle, instructed IEEE Spectrum the place issues are headed.

Why is CMOS getting into a brand new section?

Julien Ryckaert: CMOS was the know-how reply to construct microprocessors within the Nineteen Sixties. Making issues smaller—transistors and interconnects—to make them higher labored for 60, 70 years. However that has began to interrupt down.

Why has CMOS scaling been breaking down?

Ryckaert: Through the years, individuals have made system-on-chips (SoCs)—corresponding to CPUs and GPUs—an increasing number of advanced. That’s, they’ve built-in an increasing number of operations onto the identical silicon die. That is sensible, as a result of it’s so rather more environment friendly to maneuver information on a silicon die than to maneuver it from chip to chip in a pc.

For a very long time, the cutting down of CMOS transistors and interconnects made all these operations work higher. However now, it’s beginning to be tough to construct the entire SoC, to make all of it higher by simply scaling the gadget and the interconnect. For instance, SRAM [the system’s cache memory] not scales in addition to logic.

What’s the answer?

Ryckaert: Seeing that one thing totally different must occur, we at Imec requested: Why can we scale? On the finish of the day, Moore’s legislation shouldn’t be about delivering smaller transistors and interconnects, it’s about reaching extra performance per unit space.

So what you might be beginning to see is breaking out sure features, corresponding to logic and SRAM, constructing them on separate chiplets utilizing applied sciences that give every the most effective benefit, after which reintegrating them utilizing superior 3D packaging applied sciences. You possibly can join two features which are constructed on the totally different substrates and obtain an effectivity in communication between these two features that’s aggressive with how environment friendly they had been when the 2 features had been on the identical substrate. That is an evolution to what we name good disintegration, or system know-how co-optimization.

So is that CMOS 2.0?

Ryckaert: What we’re doing in CMOS 2.0 is pushing that concept additional, with a lot finer-grained disintegration of features and stacking of many extra dies. A primary signal of CMOS 2.0 is the approaching arrival of backside-power-delivery networks. On chips immediately, all interconnects—each these carrying information and people delivering energy—are on the entrance aspect of the silicon [above the transistors]. These two forms of interconnect have totally different features and totally different necessities, however they’ve needed to exist in a compromise till now. Bottom energy strikes the power-delivery interconnects to beneath the silicon, basically turning the die into an lively transistor layer which is sandwiched between two interconnect stacks, every stack having a special performance.

Will transistors and interconnects nonetheless must hold scaling in CMOS 2.0?

Ryckaert: Sure, as a result of someplace in that stack, you’ll nonetheless have a layer that also wants extra transistors per unit space. However now, as a result of you could have eliminated all the opposite constraints that it as soon as had, you might be letting that layer properly scale with the know-how that’s completely suited to it. I see fascinating occasions forward.

This text seems within the March print situation as “5 Questions for Julien Ryckaert.”